型号:

AGLP-EVAL-KIT

RoHS:无铅 / 符合
制造商:Microsemi SoC描述:KIT EVAL HARDWARE FOR AGLP
详细参数
数值
产品分类 编程器,开发系统 >> 通用嵌入式开发板和套件(MCU、DSP、FPGA、CPLD等)
AGLP-EVAL-KIT PDF
标准包装 1
系列 IGLOO PLUS
类型 FPGA
适用于相关产品 AGLP125
所含物品 板,电缆,DVD,跳线,电源,编程器
其它名称 1100-1137
相关参数
STBV45G-AP STMicroelectronics TRANS NPN 400V FAST SW TO-92AP
TLV431BH6TA Diodes Inc IC VREF SHUNT ADJ SC-70-6
GLF-466-076-511-D I.O. Interconnect ASSEMBLY 6 POSITION 6 CONTACT
ESM10DSXS Sullins Connector Solutions CONN EDGECARD 20POS DIP .156 SLD
ECA18DTMD Sullins Connector Solutions CONN EDGECARD 36POS R/A .125 SLD
0151660207 Molex Inc FFC 0.50 TYPE A 20 CKTS LGT 51
510-26-6400-BL-0014F CNC Tech MODULAR CBL STRAIGHT 14'
STM3240G-SK/IAR STMicroelectronics KIT STARTER FOR STM32F407
HT-SCE-1K-3/16-2.0-9 TE Connectivity HEAT SHRINK SLEEVE MARKER
STBV45G-AP STMicroelectronics TRANS NPN 400V FAST SW TO-92AP
ECA15DTKT Sullins Connector Solutions CONN EDGECARD 30POS DIP .125 SLD
XCARD XC-2 XMOS BOARD DEV KIT XS1-G4 ETHERNET
ZMM5242B-13 Diodes Inc DIODE ZENER 12V 500MW MINIMELF
HT-SCE-1K-3/16-2.0-0 TE Connectivity HEAT SHRINK SLEEVE MARKER
EA-EDU-001 Embedded Artists BOARD EDUCATION LPC2148
ZMM5241B-13 Diodes Inc DIODE ZENER 11V 500MW MINIMELF
TMS-SCE-1K-1-2.0-0 TE Connectivity HEAT SHRINK SLEEVE MARKER
510-26-4400-WH-0014F CNC Tech MODULAR CBL STRAIGHT 14'
TLV431BE5TA Diodes Inc IC VREF SHUNT ADJ SOT-25
ZMM5240B-13 Diodes Inc DIODE ZENER 10V 500MW MINIMELF